Potting adhesive for water-cooled plate of buried copper pipe

CC3 - 300AB is a two - component epoxy potting adhesive specially designed for the copper tube inlay of the aluminum plate heat dissipation circulation system of water - cooled plates.Before mixing, Component A is a gray epoxy thick liquid with a viscosity of 80,000 - 120,000 mPa·s. Component B has two types of hardeners. The viscosity of Hardener B1 is less than 50 mPa·s, and that of Hardener B2 is 50 - 150 mPa·s. The specific gravity of both is 0.9 - 0.96 g/cm³. The shelf life of each component is 1 year when stored sealed at room temperature.After mixing, the mixture with either B1 or B2 is gray. When mixed with B2, the viscosity at 25°C is 9,000 - 11,000 mPa·s. In terms of curing, it can be cured either at room temperature or by heating. The curing is faster when mixed with B1, and the pot life varies. After curing, it has a hardness of 80 - 85D and a thermal conductivity of over 2.6 W/(m·K), as well as good mechanical properties. It maintains a relatively high strength in various chemical environments. It is suitable for various heat - dissipation products and potting products with high thermal conductivity requirements. However, its electrical insulation strength is low, so it should be used with caution in products with high electrical performance requirements.